The US1M is a surface mount ultra fast diode in SMB (DO-214AC) package.
The device features glass passivated chip junction, low forward voltage and low power loss, ultrafast recovery time for high efficiency and low profile package.
We have Various sizes of Diode. Check out our complete collection of Diode.
If you are in Nashik you can buy this Electronic Component at our local shop at New CBS, Nashik or you can place order online and get it delivered at your doorstep anywhere in India. |
Ideal for automated placement
Maximum repetitive reverse voltage Vrrm of 1KV
Non repetitive peak forward surge current IFSM of 30A
Maximum forward Voltage VF of 1.7V at IF 1A
Maximum forward current IF(AV) of 1A
Operating temperature range -65°C to 150°C
Reverse recovery time trr of 75ns
Glass passivated junction chip.
For surface mounted application.
Low profile package.
Built-in strain relief.
Ideal for automated placement.
Easy pick and place.
Superfast recovery time for high efficiency.
Glass passivated chip junction.
High temperature soldering: 260°C/10 seconds at terminals.
Plastic material.
Power Management,
Industrial,
Portable Devices,
Consumer Electronics,
Automotive.
See 1 Ratings & Reviews |
The US1M is a surface mount ultra fast diode in SMB (DO-214AC) package.
The device features glass passivated chip junction, low forward voltage and low power loss, ultrafast recovery time for high efficiency and low profile package.
We have Various sizes of Diode. Check out our complete collection of Diode.
If you are in Nashik you can buy this Electronic Component at our local shop at New CBS, Nashik or you can place order online and get it delivered at your doorstep anywhere in India. |
Ideal for automated placement
Maximum repetitive reverse voltage Vrrm of 1KV
Non repetitive peak forward surge current IFSM of 30A
Maximum forward Voltage VF of 1.7V at IF 1A
Maximum forward current IF(AV) of 1A
Operating temperature range -65°C to 150°C
Reverse recovery time trr of 75ns
Glass passivated junction chip.
For surface mounted application.
Low profile package.
Built-in strain relief.
Ideal for automated placement.
Easy pick and place.
Superfast recovery time for high efficiency.
Glass passivated chip junction.
High temperature soldering: 260°C/10 seconds at terminals.
Plastic material.
Power Management,
Industrial,
Portable Devices,
Consumer Electronics,
Automotive.